Integrated High-Performance Microcapsule Fire Extinguishing System for Confined Spaces with Real-Time Monitoring and Early Warning Capabilities

Abstract

Small-scale fires in confined spaces represent critical precursors to catastrophic disasters, making their early suppression essential for safeguarding lives and property. However, conventional fire extinguishing systems in confined space often lack real-time temperature monitoring and efficient active extinguishing capabilities, combined with human factors such as lapses in attention, frequently leading to fire escalation. To address these limitations, we developed an integrated fire extinguishing system based on the high-performance composite microcapsules, enabling rapid fire extinguishment and environmental cooling during incipient stages. The system combines real-time thermal monitoring, wireless data transmission, and intelligent temperature regulation. The system consists of three core components: a mounting assembly supporting flexible installation, a fire suppression module composed of two-dimensional microcapsule patches, and a temperature-sensing unit for continuous environmental monitoring. The microcapsule patches, thermally triggered to release fire-extinguishing agents, exhibit high extinguishing efficiency and rapid cooling, thereby enabling proactive fire containment in confined spaces. Simultaneously, the sensing module provides real-time thermal surveillance with wireless data transmission to remote terminals. Experimental validation confirms the system’s efficacy in rapid fire suppression, ambient cooling, and intelligent early warning, offering an innovative solution for confined space fire risk mitigation.

Supplementary files

Article information

Article type
Paper
Accepted
19 Dec 2025
First published
30 Dec 2025

Lab Chip, 2026, Accepted Manuscript

Integrated High-Performance Microcapsule Fire Extinguishing System for Confined Spaces with Real-Time Monitoring and Early Warning Capabilities

Q. Pan, J. Zhang, J. Fu, N. Sang, D. Ding, P. Zhang, C. Li, T. Zhou, T. Si, F. Huang and Z. Zhu, Lab Chip, 2026, Accepted Manuscript , DOI: 10.1039/D5LC01053E

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