Thermal transport in mechanically deformed two-dimensional materials and designed structures with their applications

Abstract

Two-dimensional (2D) materials have garnered notable research interest due to their extraordinary properties. Assembling two or more 2D materials into heterostructures introduces properties that are not present in any individual components, leading to a spectrum of nanodevices and applications. The lifetime and performance of nanodevices can be largely dictated by the working temperatures, and the heat dissipation in 2D materials and heterostructures is vital to the reliability and functionality of devices. However, mechanical effects encountered can potentially impact thermal transport. A comprehensive understanding of the interplay between mechanical loadings and thermal transport in 2D materials and their heterostructures is fundamental to devising effective cooling strategies for devices operating under complex conditions. The tunable thermal properties of these materials offer a platform for designing mechanically adjustable devices and reversible performance optimization. This review starts with a summary of the thermal conductivities (TCs) in various 2D materials adjusted by mechanical loadings. A brief overview of the underlying tuning mechanism is provided, followed by a discussion on the effect of structural designs. Several potential applications based on the thermo-mechanical correlation are mentioned. Finally, the current limitations and challenges in the field are included, and several suggestions for future research directions are discussed.