Stabilization of lead-free bulk CsSnI3 perovskite thermoelectrics via incorporation of TiS3 nanoribbon clusters

Abstract

The intense research for efficient low-temperature thermoelectric materials drives the exploration of innovative compounds and composite systems. This study investigates the effects of integrating low-dimensional titanium trisulfide (TiS₃) into bulk tin-based halide perovskites (CsSnI₃) for thermoelectric applications. The incorporation of small amounts of two-dimensional titanium trisulfide (TiS₃) into CsSnI₃ not only significantly enhanced the structural stability of the composite material and suppressed oxidation processes but also ensured that its initial electrical properties, including conductivity and the Seebeck coefficient, remained stable for at least 24 hours—unlike the pristine CsSnI₃ sample. These findings emphasize the potential of low-dimensional TiS₃ as an effective additive for stabilizing the thermoelectric performance of CsSnI₃-based materials over time.