Interfacial Co–O–Cu bonds prompt electrochemical nitrate reduction to ammonia in neutral electrolyte

Kai Yao; Zhaobin Fang; Weijie Yan; Yawu Wang; Zhenyong Song; Wenhai Wang; Jieyue Wang; Xianwen Wei; Yiwei Tan; Dehong Wu; Konglin Wu; Binbin Jiang

doi:10.1039/D3CC05801H

Interfacial Co–O–Cu bonds prompt electrochemical nitrate reduction to ammonia in neutral electrolyte†

Kai Yao,^a Zhaobin Fang,^a Weijie Yan,^a Yawu Wang,^a Zhenyong Song,^a Wenhai Wang,^a Jieyue Wang,^a Xianwen Wei,^a Yiwei Tan,^c Dehong Wu,*^b Konglin Wu

*^a and Binbin Jiang

*^d

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* Corresponding authors

^a Institute of Clean Energy and Advanced Nanocatalysis (iClean), School of Chemistry and Chemical Engineering, Anhui University of Technology, Maanshan 243032, China
E-mail: klwuchem@ahut.edu.cn

^b Emergency Management Bureau of Jiangan County, Yibin 644200, China
E-mail: wudehong511523@163.com

^c State Key Laboratory of Materials-Oriented Chemical Engineering, Nanjing University of Technology, Nanjing 211816, China

^d School of Chemistry and Chemical Engineering, Anqing Normal University, Anqing 246001, China
E-mail: jiangbb@aqnu.edu.cn

Abstract

In this work, the formed interfacial Co–O–Cu bonds in Co-doped Cu(OH)₂ (Co₂–Cu(OH)₂) sufficiently expose active sites and improve the reaction kinetics. As a result, the optimal Co₂–Cu(OH)₂ provides an amazing faradaic efficiency (91.6%), high selectivity (93.2%) and robust stability toward the NO₃RR.

Chemical Communications

Interfacial Co–O–Cu bonds prompt electrochemical nitrate reduction to ammonia in neutral electrolyte†

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Interfacial Co–O–Cu bonds prompt electrochemical nitrate reduction to ammonia in neutral electrolyte

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