Dynamic Hydrogen Bond Evolution in Thermosensitive Hydrogels for Self-Adaptive Passive Cooling

Abstract

Facing the growing demand for green cooling, the application of thermosensitive hydrogels in adaptive thermal management is limited due to the kinetic-thermodynamic mismatch of water molecules during their phase transition. Herein, we propose a dynamic gradient hydrogen bonding hydrogel (hydrogen bonding energy in P(NAGA-CO-NIPAm hydrogel showing a gradient with increasing temperature) via artificial intelligence (AI) assisted component optimization to construct thermosentive hydrogels with hierarchical synergistic dissipative pattern, which combine both phase-volume stability and optical transition properties, enabling adaptive passive cooling. The P(NAGA-CO-NIPAm)-4* thermosensitive hydrogel possesses a triple synergistic mechanism (dynamic hydrogen bonding, hydrophobic aggregation, and light scattering) and exhibits excellent adaptive evaporative cooling capability (5°C: 21.97 W/m² → 25°C: 53.99 W/m² → 45°C: 608.94 W/m²), which effectively solves the mismatch between water-molecule transport dynamics and material thermodynamic response. At 45 °C, the cooling duration of P(NAGA-CO-NIPAm)-4* hydrogel exceeded that of conventional PNIPAm hydrogels by over 10-fold. Compared to PNAGA and PNIPAm, P(NAGA-CO-NIPAm)-4* exhibits the best cooling capacity in extreme environments (60°C and 800 W/m²) , cooling to 41.33°C (ΔT = 17.44°C, 29.68%). The results provide a theoretical foundation and practical framework for next-generation adaptive cooling materials, with significant scientific and practical value in mitigating global cooling demands.

Supplementary files

Article information

Article type
Paper
Submitted
22 Dec 2025
Accepted
10 Mar 2026
First published
10 Mar 2026

J. Mater. Chem. A, 2026, Accepted Manuscript

Dynamic Hydrogen Bond Evolution in Thermosensitive Hydrogels for Self-Adaptive Passive Cooling

S. Ge, N. Yang, X. Zhu, X. Min, Y. Kong, C. Xu, H. Yang and J. Wang, J. Mater. Chem. A, 2026, Accepted Manuscript , DOI: 10.1039/D5TA10414A

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