A review of self-healing mechanisms for the application of conductive electronic products

Abstract

The rapid growth of electronic devices has raised concerns about durability and e-waste. Self-healing materials offer a promising solution by extending device lifespan and reducing maintenance needs. This review examines the use of self-healing materials in conductive electronic systems, focusing on intrinsic and extrinsic mechanisms. Extrinsic methods use microcapsules or vascular systems to release healing agents, while intrinsic approaches rely on reversible bonds, such as hydrogen bonding, ionic interactions, and metal coordination, to enable repeatable repair. Applications discussed include strain sensors, energy storage, and flexible electronics. The review highlights how these materials improve reliability in wearable devices, energy harvesters, and wireless systems. Critical factors affecting healing performance, like healing time, environment, and material design, are also analyzed. This review serves as a useful reference for selecting suitable self-healing strategies for next-generation electronic applications.