Multi-scale interface induced 3D percolation network in polymeric heterostructures for EMI shielding application

Abstract

For addressing the limitations of traditional metal-based electromagnetic interference (EMI) shielding materials, such as insufficient flexibility and susceptibility to corrosion, this study developed a fluorosilicone rubber (FVMQ) matrix composite with superior polarization response by constructing multi-scale heterogeneous interface structures. Multi-walled carbon nanotubes (MWCNTs) and silver-coated copper powder (Ag@Cu) were employed as functional fillers to optimize the electromagnetic and mechanical properties of the material system through precise regulation of the filler-matrix interface interactions. The metal-insulator interface formed between the Ag@Cu filler and the rubber matrix induces a strong interfacial polarization effect, thereby significantly enhancing the dielectric loss capacity of the material. Simultaneously, the three-dimensional network structure of MWCNTs not only improves the continuity of the conductive pathways but also markedly increases the crosslinking density of the composite due to its robust interaction with the rubber molecular chains. This multi-scale interface engineering effectively suppresses the formation of internal defects within the material, blocks water diffusion pathways, and enables the material to exhibit excellent corrosion resistance (contact angle >112°) and long-term stability. Results demonstrate that the heterogeneous composite possesses remarkable advantages in EMI shielding performance, achieving a shielding efficiency exceeding 109 dB. Notably, the material also exhibits superior electrothermal response characteristics under electric drive. It can achieve rapid temperature elevation above 130 °C under a low-voltage drive of 3.5 V, while maintaining outstanding mechanical properties (elongation at break >400%, tensile strength >3 MPa). The integration of EMI shielding, electrothermal conversion, and mechanical flexibility into a single multifunctional system highlights its potential for applications in complex environments. This study provides a critical interface design strategy for the development of next-generation flexible EMI shielding materials.

Supplementary files

Transparent peer review

To support increased transparency, we offer authors the option to publish the peer review history alongside their article.

View this article’s peer review history

Article information

Article type
Paper
Submitted
30 Apr 2025
Accepted
17 Jun 2025
First published
18 Jun 2025

J. Mater. Chem. C, 2025, Accepted Manuscript

Multi-scale interface induced 3D percolation network in polymeric heterostructures for EMI shielding application

J. Sun, L. Mao, Z. Gao, L. Deng, Q. Chen, Y. Li, C. Liu, C. Shen and X. Liu, J. Mater. Chem. C, 2025, Accepted Manuscript , DOI: 10.1039/D5TC01738F

To request permission to reproduce material from this article, please go to the Copyright Clearance Center request page.

If you are an author contributing to an RSC publication, you do not need to request permission provided correct acknowledgement is given.

If you are the author of this article, you do not need to request permission to reproduce figures and diagrams provided correct acknowledgement is given. If you want to reproduce the whole article in a third-party publication (excluding your thesis/dissertation for which permission is not required) please go to the Copyright Clearance Center request page.

Read more about how to correctly acknowledge RSC content.

Social activity

Spotlight

Advertisements