Optimized dielectric performance in bismaleimide–triazine resin via a dual-modification strategy for high-frequency electronic packaging

Abstract

High-speed and high-quality signal transmission in the fifth-generation mobile communication system poses significant challenges for the dielectric properties and operational reliability of existing electronic packaging materials. In this study, a synergistic modification of bismaleimide–triazine (BT) resin was conducted using diallyl bisphenol A (DBA) and polyphenylene oxide (PPO) to optimize the comprehensive performance of the polymer composite, particularly in terms of dielectric, mechanical, and thermal performance. Specifically, the dielectric constant (D_k) and dielectric loss were reduced from 2.75 and 0.0084 to 2.72 and 0.0041 at 10 GHz, respectively, while maintaining excellent D_k stability across a broad temperature range of −40 to 140 °C. Moreover, the glass transition temperature (T_g) of the modified BT resin reached 279.1 °C (an increase of 16.7 °C compared to pristine BT resin), and the bending strength was as high as 225.8 MPa. This work provides a promising strategy for developing high-performance BT-based electronic packaging materials.