Issue 15, 2025

Unraveling the adhesion characteristics of ruthenium as an advanced metal interconnect material using machine learning potential

Abstract

As the dimensions of semiconductor devices continue to shrink and the complexity of the manufacturing process increases, metal interconnects that link different parts of integrated circuits have become a key factor in determining device performance, speed, and power efficiency. Until recently, copper (Cu) has been used as a metal interconnect material, but due to a sharp increase in resistance at sub-10 nm, ruthenium (Ru) is considered a promising candidate for advanced interconnect materials. In order to employ Ru as the interconnect material, it is necessary to secure adhesion characteristics with amorphous SiO2, which is used as a representative insulator, but there is little understanding of the interfacial adhesion especially within an atomistic perspective. This study combines machine learning potential and steered molecular dynamics to provide atomic-level understanding of the adhesion properties of Ru/SiO2 interfaces. It was found that the presence of hydroxyl groups on the surface of SiO2 significantly affects the adhesion and the removal of hydrogen atoms from the hydroxyl groups is remarkably effective in increasing adhesion, even under excessive conditions. The analysis of the bonding characteristics between Ru and interfacial atoms of SiO2 suggests that the degree of bonding between Ru and oxygen atoms is crucial for adhesion, and that the adhesion characteristics can be predicted through the bond order of interfacial atoms.

Graphical abstract: Unraveling the adhesion characteristics of ruthenium as an advanced metal interconnect material using machine learning potential

Supplementary files

Article information

Article type
Paper
Submitted
18 Nov 2024
Accepted
03 Mar 2025
First published
17 Mar 2025

J. Mater. Chem. C, 2025,13, 7772-7784

Unraveling the adhesion characteristics of ruthenium as an advanced metal interconnect material using machine learning potential

E. Cho, W. Son, S. Lee, H. Do, K. Min and D. S. Kim, J. Mater. Chem. C, 2025, 13, 7772 DOI: 10.1039/D4TC04870A

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