Issue 14, 2025

A new quaternary sphalerite-derivative compound for thermoelectric applications: Cu7VSnS8

Abstract

Cu–S-based multinary compounds with sphalerite-derivative structures have received attention due to their potential as thermoelectric materials. Recently, we proposed a strategy to design Cu–S-based quaternary compounds, “the pseudo-binary approach”. Within the Cu3SbS4–Cu4TiS4 (Cu3+xSb1−xTixS4) system, this new approach led us to discover Cu30Ti6Sb2S32, at x = 0.75. In this study, we adopted the same approach for the “Cu3SnS4”–“Cu4VS4” and (Cu3+xSn1−xVxS4) system. Although the ordered end-point compounds are not known, a semiconducting quaternary phase, Cu7VSnS8, was discovered at x = 0.5. Single crystal X-ray diffraction has revealed that this new compound crystallizes in a tetragonal sphalerite derivative structure with space group P[4 with combining macron]m2. Electronic and phonon/vibrational properties were investigated by combining experiments and theory. Cu7VSnS8 allows partial substitution of Ti for V, leading to the increase of the hole carrier concentration and the thermoelectric power factor. The relatively large power factor of 0.5 mW K−2 m−1, combined with a low lattice thermal conductivity of 0.5 W K−1 m−1, yields a large dimensionless figure of merit ZT = 0.6–0.7 at 673 K for unoptimized hot-pressed samples of Cu7V1−yTiySnS8 (y = 0.25, 0.5, 0.75). High-temperature stability was also examined by thermogravimetry and X-ray diffraction.

Graphical abstract: A new quaternary sphalerite-derivative compound for thermoelectric applications: Cu7VSnS8

Supplementary files

Article information

Article type
Paper
Submitted
15 Nov 2024
Accepted
25 Feb 2025
First published
11 Mar 2025

J. Mater. Chem. A, 2025,13, 10028-10036

A new quaternary sphalerite-derivative compound for thermoelectric applications: Cu7VSnS8

S. Kozai, K. Suekuni, S. Takahashi, E. Nishibori, H. Kasai, I. Siloi, M. Fornari, H. Saito, P. Sauerschnig, M. Ohta, P. Lemoine, E. Guilmeau, B. Raveau and M. Ohtaki, J. Mater. Chem. A, 2025, 13, 10028 DOI: 10.1039/D4TA08137D

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