Issue 23, 2025

Development of a semiconducting supramolecular copper(ii)–metallogel for antimicrobial and microelectronic device applications

Abstract

A novel supramolecular metallogel was synthesized at room temperature using copper(II) acetate and isophthalic acid as gelators in N,N-dimethylamine. Rheological studies demonstrated the metallogel's robust mechanical stability under diverse conditions. FESEM imaging and EDX mapping provided detailed insights into its microstructure and elemental composition. The formation of the metallogel was confirmed through FT-IR spectroscopy, which highlighted the successful coordination between the metal ion and the organic ligand. Electrical property analysis revealed its semiconducting nature with impressive conductivity. Additionally, antimicrobial studies showed that the Cu(II)-based metallogel exhibited significant efficacy against Gram-positive and Gram-negative bacteria, making it a promising candidate for combating bacterial infections. These findings establish the developed metallogel as a versatile multifunctional material with dual applicability in electronics and biomedicine. Furthermore, its semiconducting properties suggest its potential integration into advanced electronic devices, while its antimicrobial activity highlights its potential in medical treatments. This study underscores the potential of Cu(II)–isophthalic acid-based metallogels, combining mechanical resilience, electrical conductivity, and antimicrobial efficacy to address various critical technological and biomedical challenges.

Graphical abstract: Development of a semiconducting supramolecular copper(ii)–metallogel for antimicrobial and microelectronic device applications

Supplementary files

Article information

Article type
Paper
Submitted
04 Mar 2025
Accepted
20 May 2025
First published
02 Jun 2025
This article is Open Access
Creative Commons BY-NC license

RSC Adv., 2025,15, 18392-18402

Development of a semiconducting supramolecular copper(II)–metallogel for antimicrobial and microelectronic device applications

S. Some, P. Das, S. Pal, S. Dhibar, D. Kumari, S. Bhattacharjee, S. J. Ray, T. O. Ajiboye, S. Dam, P. P. Ray and B. Saha, RSC Adv., 2025, 15, 18392 DOI: 10.1039/D5RA01535A

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