Issue 17, 2025

Self-sacrificial synthesis of Cu3(HHTP)2 on Cu substrate for recyclable NH3 gas adsorption with energy-efficient photothermal regeneration

Abstract

The efficient adsorption and removal of toxic gases, particularly ammonia (NH3), remains a critical challenge in environmental management and industrial safety. Metal–organic frameworks (MOFs) have emerged as promising gas adsorbents due to their tunable structures and high surface area. However, the strong interaction between NH3 and MOFs poses challenges for the regeneration and reusability of MOF adsorbents, often requiring energy-intensive desorption methods. This study proposes a sustainable approach for regenerating adsorption sites for recyclable gas adsorbents. We present a facile method for the direct synthesis of Cu3(HHTP)2 on a Cu mesh substrate (Cu3(HHTP)2@Cu), utilizing the Cu metal itself as a precursor to eliminate the need for external metal sources. The resulting Cu3(HHTP)2@Cu serves as a recyclable NH3 adsorbent, leveraging the π-conjugated hexahydroxytriphenylene (HHTP) ligand for photothermal conversion under sunlight irradiation, where photo-generated heat facilitates NH3 desorption. The study further explores the effect of an external voltage on the NH3 adsorption performance and crystalline structure of Cu3(HHTP)2@Cu. Our findings demonstrate that Cu3(HHTP)2@Cu achieves efficient NH3 desorption through a minimally invasive and energy-efficient mechanism, addressing the limitations of conventional adsorbents.

Graphical abstract: Self-sacrificial synthesis of Cu3(HHTP)2 on Cu substrate for recyclable NH3 gas adsorption with energy-efficient photothermal regeneration

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Article information

Article type
Paper
Submitted
26 Feb 2025
Accepted
22 Apr 2025
First published
28 Apr 2025
This article is Open Access
Creative Commons BY-NC license

RSC Adv., 2025,15, 13583-13594

Self-sacrificial synthesis of Cu3(HHTP)2 on Cu substrate for recyclable NH3 gas adsorption with energy-efficient photothermal regeneration

S. Jin, J. Lee, S. Kim, G. C. Kim, J. Yun and J. Kim, RSC Adv., 2025, 15, 13583 DOI: 10.1039/D5RA01388G

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