Issue 13, 2025, Issue in Progress

Improved thermoelectric properties of α-phase Cu2Se thin films through multiphase nanostructuring

Abstract

Copper selenide (Cu2Se) has been extensively studied due to its promising thermoelectric properties in bulk form. However, the miniaturization of thermoelectric devices using thin films is highly desired for smart applications. To date, there are few reports on composite thin films of Cu2Se for thermoelectric applications, primarily due to their lower conversion efficiency. In the present work, Cu2Se-based multiphase nanocomposites are presented to demonstrate enhanced conversion efficiency. The detailed structural characterization reveals that thermally evaporated Te-doped Cu2Se thin films have multiphase compositions. The electrical conductivity decreases after Te-doping, due to enormous scattering of carriers against secondary phases and lattice defects. However, upon further increasing Te-doping concentration, both the electrical conductivity and Seebeck coefficient start increasing simultaneously, due to the formation of Cu2Te nanoclusters and Te–Se solid solution, in the matrix of Cu2Se. We emphasize the power factor, with the highest value reaching 234.0 μW mK−2 at 400 K, as a key indicator of thermoelectric performance. A slightly overestimated value of dimensionless figure-of-merit (ZT) of 0.2 was obtained using the power factor and merely the electronic part of the thermal conductivity. The current synthesis route synergizes the effects of a multiphase system in thin film research to enhance the thermoelectric efficiency of Cu2Se and related materials classes.

Graphical abstract: Improved thermoelectric properties of α-phase Cu2Se thin films through multiphase nanostructuring

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Article information

Article type
Paper
Submitted
15 Jan 2025
Accepted
22 Mar 2025
First published
31 Mar 2025
This article is Open Access
Creative Commons BY-NC license

RSC Adv., 2025,15, 9854-9863

Improved thermoelectric properties of α-phase Cu2Se thin films through multiphase nanostructuring

M. F. Masoud, S. Butt, M. Waseem Akram, N. Naeem, A. Irfan, A. Abbas and S. Irfan, RSC Adv., 2025, 15, 9854 DOI: 10.1039/D5RA00370A

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