PEG/GO Phase-change Composite Aerogel Microspheres with Highly Ordered Center-diverging Microchannels and the Efficient Thermal Management for Electronic Devices

Abstract

The stability and reliability correlated to the temperature boost originating from the heat release in operation were a vital issue for the electronic devices, which might severely influence the effectiveness or cause combustion. By combining phase change materials (PCMs) with heat storage capabilities and graphene oxide (GO) with high thermal conductivity, the composite structure with certain morphology possessing the function of temperature regulation is anticipated to be an ideal solution. In this study, electrostatic spraying technology was effectively employed to fabricate GO/polyethylene glycol (PEG) phase-change aerogel microspheres (GPAMs), using GO as the supporting material and PEG as the PCM. Subsequent freeze-drying processes induced ordered pore structures through an ice-template mechanism. The mild and straightforward method enabled the effective integration of GO aerogels with PEG. The obtained GPAMs had an intact spherical shape with dimensions ranging from 100 to 200 μm. The load rate of GPAMs reached 95% with the ∆Hm of 151.9 J/g, which ensured the fantastic performance of heat storage capacity, and the center-diverging conical pores guaranteed high stability during the phase change process. The fabrication technology provided a novel approach to developing composite aerogel microspheres. The GPAMs with controllable micron-sized and ordered heat conduction pathways can overcome the limitations of traditional bulk GO aerogels to meet the requirements of various electronic devices and have bright prospects in thermal management, especially for micro devices.

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Article information

Article type
Paper
Submitted
27 Feb 2025
Accepted
28 May 2025
First published
29 May 2025

New J. Chem., 2025, Accepted Manuscript

PEG/GO Phase-change Composite Aerogel Microspheres with Highly Ordered Center-diverging Microchannels and the Efficient Thermal Management for Electronic Devices

L. Cao, J. Li, P. Li, W. Li, H. Liu, J. Ren and J. Lei, New J. Chem., 2025, Accepted Manuscript , DOI: 10.1039/D5NJ00891C

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