Investigating the Mechanism of Copper-Carbon Interactions in Ultraconductor Materials via In-Situ Thermal X-Ray and Raman Spectroscopy

Abstract

Improving energy transfer efficiency is critical to advancing technologies for a more sustainable future. Nanoscale materials, specifically metal-carbon composites such as ultraconductors, have shown promise in this field due to their enhanced electrical and thermal conductivities. However, the origin of the enhancement has yet to be determined. Prior research has primarily explored these materials at room temperature in an attempt to explain this phenomenon, but these materials have not yet been examined under enhanced thermal conditions. This study probes ultraconductor materials during the heating process to uncover the origins of their enhanced thermal conductivity. Understanding the mechanism underpinning the enhanced properties of the material could lead to increased property enhancement and therefore improved performance in energy transfer technologies. In this work we employ in situ thermal X-Ray Absorption Near Edge Spectroscopy (XANES) and Raman spectroscopy to characterize copper-based covetic materials, revealing how thermal conditions influence the bonding environment and interaction between the copper and infused carbon. Our findings suggest that heating the materials does not result in the formation of chemical bonds between the carbon and copper framework of the material but rather points to a primarily physical interaction within the sample. Furthermore, we hypothesize possible mechanisms underlying the nature of the physical interaction leading to enhanced properties. These insights contribute to a deeper understanding of the material’s behavior under relevant thermal conditions and highlight its potential for integration into next-generation energy systems.