Temperature-guided solidification of copper coordination complexes as hole transport materials

Abstract

We report a rapid and controllable solid-state formation process of copper coordination complex hole-transport materials (HTMs) in dye-sensitized solar cells (DSCs), reducing processing times from over 48 h to 20 min. By thermally-induced phase transition of Cu(I/II)(tmby)2-based liquid electrolytes from 50 °C to 110 °C, we demonstrated that a 70 °C post-treatment for 20 min is ideal for creating an amorphous HTM with minimal crystallization. Time-dependent Raman spectra confirmed near-complete solvent removal within 20 min, while scanning electron microscopy highlighted a compact, defect-minimized HTM morphology when 4-tert-butylpyridine was employed versus N-methylbenzimidazole. Transient absorption spectroscopy revealed ultrafast dye regeneration (t1/2,reg = 487 ns) and near-unity regeneration efficiency (99.2%) for short heat treatments, whereas extended treatments (e.g., 60 min) led to μs-scale recombination (26.8 μs) and lower performance. Electrochemical impedance spectroscopy indicated stable charge-transfer resistances at the TiO2/HTM interface (from 25.6 Ω in liquid state to 27.5 Ω in solid state), confirming efficient hole transport pathways. Under 1 sun illumination, devices retained up to ≈10% power conversion efficiency, while indoor (1000 lux) conditions yielded photocurrents up to 79 μA cm−2 and peak efficiencies of 16%. These findings establish a robust, reproducible route to form Cu-based HTMs in solid-state DSCs with enhanced low-light performance and highlight key design parameters controlling morphology, interfacial charge transfer, and photovoltaic yield.

Graphical abstract: Temperature-guided solidification of copper coordination complexes as hole transport materials

Supplementary files

Article information

Article type
Paper
Submitted
03 Apr 2025
Accepted
04 Jul 2025
First published
10 Jul 2025
This article is Open Access
Creative Commons BY license

Phys. Chem. Chem. Phys., 2025, Advance Article

Temperature-guided solidification of copper coordination complexes as hole transport materials

T. Keller, I. Benesperi, J. Thyr, T. Edvinsson, E. A. Gibson and M. Freitag, Phys. Chem. Chem. Phys., 2025, Advance Article , DOI: 10.1039/D5CP01292A

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