Issue 2, 2024

Skin-interfaced microfluidic sweat collection devices for personalized hydration management through thermal feedback

Abstract

Non-electronic wearables that utilize skin-interfaced microfluidic technology have revolutionized the collection and analysis of human sweat, providing valuable biochemical information and indicating body hydration status. However, existing microfluidic devices often require constant monitoring of data during sweat assessment, thereby impeding the user experience and potentially missing anomalous physiological events, such as excessive sweating. Moreover, the complex manufacturing process hampers the scalability and large-scale production of such devices. Herein, we present a self-feedback microfluidic device with a unique dehydration reminder through a cost-effective “CAD-to-3D device” approach. It incorporates two independent systems for sweat collection and thermal feedback, including serpentine microchannels, reservoirs, petal-like bursting valves and heating chambers. The device operates by sequentially collecting sweat in the channels and reservoirs, and then activating thermal stimulators in the heating chambers through breaking the valves, initiating a chemical exothermic reaction. Human trials validate that the devices effectively alert users to potential dehydration by inducing skin thermal sensations triggered by sweat sampling. The proposed device offers facile scalability and customizable fabrication, and holds promise for managing hydration strategies in real-world scenarios, benefiting individuals engaged in sporting activities or exposed to high-temperature settings.

Graphical abstract: Skin-interfaced microfluidic sweat collection devices for personalized hydration management through thermal feedback

Supplementary files

Article information

Article type
Paper
Submitted
19 Sep 2023
Accepted
04 Dec 2023
First published
07 Dec 2023

Lab Chip, 2024,24, 356-366

Skin-interfaced microfluidic sweat collection devices for personalized hydration management through thermal feedback

H. Yang, H. Ding, W. Wei, X. Li, X. Duan, C. Zhuang, W. Liu, S. Chen and X. Wang, Lab Chip, 2024, 24, 356 DOI: 10.1039/D3LC00791J

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