Issue 48, 2023

Thiol–ene chemistry incorporates a new spiropyran-containing polyurethane ionogel with photochromic, photomechanical and photoconductive properties

Abstract

The photocuring technology based on thiol–ene click reaction can be easily applied for copolymerizing or crosslinking the acrylate monomers for ionogels. However, there is still a problem: when the acrylate monomers contain the popular spiropyran as the stimuli-responsive group, it should be concerned about the participation of the active C[double bond, length as m-dash]C bond from the ring-opened spiropyran during a thiol–ene reaction, which may in turn affect the stimuli-responsiveness of the spiropyran. Up to now, the structure and properties of spiropyran-containing ionogels in this case have still not been well investigated. Therefore, in this work we carefully study a new spiropyran-containing polyurethane ionogel by crosslinking an acrylate-terminated, spiropyran-containing polyurethane prepolymer and a polythiol in ionic liquid through thiol–ene chemistry. It is found for the first time that, during constructing an ionogel, the coexistence of a reversible thiol–ene reaction between the C[double bond, length as m-dash]C bond from the ring-opened spiropyran and the thiol group can bring about a different reverse photochromic behavior. The proposed mechanism of the abnormal photochromism is analyzed. In addition, it is also observed that the thiol–ene chemistry can incorporate photomechanical and photoconductive properties into the new spiropyran-containing ionogel.

Graphical abstract: Thiol–ene chemistry incorporates a new spiropyran-containing polyurethane ionogel with photochromic, photomechanical and photoconductive properties

Supplementary files

Article information

Article type
Paper
Submitted
09 Aug 2023
Accepted
20 Nov 2023
First published
21 Nov 2023

Soft Matter, 2023,19, 9470-9477

Thiol–ene chemistry incorporates a new spiropyran-containing polyurethane ionogel with photochromic, photomechanical and photoconductive properties

G. Chen, R. Lin, Y. Lei, P. Cai, Y. Huang and H. Zhang, Soft Matter, 2023, 19, 9470 DOI: 10.1039/D3SM01055D

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