Issue 23, 2023

Exploring dual solutions and thermal conductivity in hybrid nanofluids: a comparative study of Xue and Hamilton–Crosser models

Abstract

Hybrid nanofluids show great potential for heat transport applications such as solar thermal systems, car cooling systems, heat sinks, and thermal energy storage. They possess better thermal stability and properties compared to standard nanofluids. In this study, a base fluid, methanol, is injected into an electrically conducting heat-generating/absorbing disk of permeable boundary, and dual solutions are obtained. Two alternative models, Xue and Hamilton–Crosser are considered, and their thermal conductivities are contrasted. Furthermore, thermal radiation and ohmic heating are also considered, and convective boundary conditions are utilized to simulate overall heat gains or losses resulting from conduction, forced or natural convection between nearby objects of nearly constant temperature. Using a similarity transform, the governing equations are obtained and numerically solved via bvp4c, a finite difference method. It is observed that the presence of a magnetic field and the shrinking of the disk elevate the energy transport rate and wall stress. Additionally, the skin friction coefficient and thermal distribution rate increase with wall transmission constraint while fluid flow and energy transport diminish. Furthermore, particle clustering and nano-layer creation suggest that the Hamilton–Crosser model exhibits better thermal conductivity than the Xue model.

Graphical abstract: Exploring dual solutions and thermal conductivity in hybrid nanofluids: a comparative study of Xue and Hamilton–Crosser models

Article information

Article type
Paper
Submitted
09 Jul 2023
Accepted
04 Nov 2023
First published
10 Nov 2023
This article is Open Access
Creative Commons BY license

Nanoscale Adv., 2023,5, 6695-6704

Exploring dual solutions and thermal conductivity in hybrid nanofluids: a comparative study of Xue and Hamilton–Crosser models

M. Sarfraz, M. Yasir and M. Khan, Nanoscale Adv., 2023, 5, 6695 DOI: 10.1039/D3NA00503H

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