Issue 47, 2022

The ultra-high thermoelectric power factor in facile and scalable single-step thermal evaporation fabricated composite SnSe/Bi thin films

Abstract

The thermoelectric effect provides a viable route for the direct conversion of thermal to electrical energy, which helps improve energy efficiency by utilizing waste heat from conventional energy resources. Herein, we report a simple fabrication of composite SnSe/Bi thin films with superior thermoelectric performance evident by their ultrahigh power factor. The composite SnSe/Bi film is deposited on a Si/SiO2 substrate by thermal evaporation techniques, providing a scalable and high-quality film. We have varied the weight percentage of Bi in SnSe to fabricate different samples, and a high-quality thin film is obtained, as confirmed by the SEM micrographs. The composite SnSe/Bi thin film shows n-type behavior due to the presence of different phases like BiSe, SnSe, and metallic Bi. Upon increasing Bi wt% in the composite film, the film's metallic nature increases, resulting in a decrease in the Seebeck coefficient and an increase in electrical conductivity. The maximum power factor of ∼800 μW m−1 K−2 at 580 K is observed for 25 wt% of Bi in the composite SnSe/Bi thin film comparable to single crystalline and polycrystalline SnSe. The significant increase in the thermoelectric performance of thin films paves the way for the development of self-powered wearable and internet of things (IoT) applications.

Graphical abstract: The ultra-high thermoelectric power factor in facile and scalable single-step thermal evaporation fabricated composite SnSe/Bi thin films

Supplementary files

Article information

Article type
Paper
Submitted
03 Sep 2022
Accepted
05 Nov 2022
First published
07 Nov 2022

J. Mater. Chem. C, 2022,10, 18017-18024

The ultra-high thermoelectric power factor in facile and scalable single-step thermal evaporation fabricated composite SnSe/Bi thin films

M. Kumar, S. Rani, R. Parmar, M. Amati, L. Gregoratti, A. Ghosh, S. Pathak, A. Kumar, X. Wang and V. N. Singh, J. Mater. Chem. C, 2022, 10, 18017 DOI: 10.1039/D2TC03719J

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