Issue 31, 2022

A highly orientational architecture formed by covalently bonded graphene to achieve high through-plane thermal conductivity of polymer composites

Abstract

Combining the advantages of high thermal conductivities and low graphene contents to fabricate polymer composites for applications in thermal management is still a great challenge due to the high defect degree of exfoliated graphene, the poor orientation of graphene in polymer matrices, and the horrible phonon scattering between graphene/graphene and graphene/polymer interfaces. Herein, mesoplasma chemical vapor deposition (CVD) technology was successfully employed to synthesize vertically aligned graphene nanowalls (GNWs), which are covalently bonded by high-quality CVD graphene nanosheets. The unique architecture leads to an excellent thermal enhancement capacity of the GNWs, and a corresponding composite film with a matrix of polyvinylidene fluoride (PVDF) presented a high through-plane thermal conductivity of 12.8 ± 0.77 W m−1 K−1 at a low filler content of 4.0 wt%, resulting in a thermal conductivity enhancement per 1 wt% graphene loading of 1659, which is far superior to that using conventional graphene structures as thermally conductive pathways. In addition, this composite exhibited an excellent capability in cooling a high-power light-emitting diode (LED) device under real application conditions. Our finding provides a new route to prepare high-performance thermal management materials with low filler loadings via the rational design of the microstructures/interfaces of graphene skeletons.

Graphical abstract: A highly orientational architecture formed by covalently bonded graphene to achieve high through-plane thermal conductivity of polymer composites

Supplementary files

Article information

Article type
Paper
Submitted
26 Apr 2022
Accepted
14 Jul 2022
First published
20 Jul 2022

Nanoscale, 2022,14, 11171-11178

A highly orientational architecture formed by covalently bonded graphene to achieve high through-plane thermal conductivity of polymer composites

Q. Yan, J. Gao, D. Chen, P. Tao, L. Chen, J. Ying, X. Tan, L. Lv, W. Dai, F. E. Alam, J. Yu, Y. Wang, H. Li, C. Xue, K. Nishimura, S. Wu, N. Jiang and C. Lin, Nanoscale, 2022, 14, 11171 DOI: 10.1039/D2NR02265F

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