Issue 22, 2021

Dynamic phase control with printing and fluidic materials' interaction by inkjet printing an RF sensor directly on a stereolithographic 3D printed microfluidic structure

Abstract

Stereolithographic (SL) three-dimensional (3D) printing of microfluidic channels and inkjet printing of radio frequency (RF) electronics are promising lab-on-a-chip technologies. However, the effective integration of the two techniques has been challenging since the fabricated parts need to be combined via an additional bonding process, such as plasma bonding. This study proposes combining RF electronics with SL printed microfluidic structures by directly inkjet printing onto a 3D printed mould. This allows the inkjet printing of RF electronics with high conductivity (8 × 106 S m−1) and high resolution (50 μm) as a surface modification of the 3D printed mould. This process combines the three-dimensional printing of microfluidic parts and the inkjet printing of RF sensors into a single process. The proposed approach increases the interaction between a printed RF part and a fluid material by adjusting the distance between them, and it can be applied to various resins and 3D printing methods. Furthermore, the proposed fabrication process was applied to a dynamic phase advanced and delayed transmission line (TL) operating at 3.8 GHz as a fluidic sensor. Consequently, using the same pattern, a higher phase shift range per microliter of 10° was obtained than the 1° for conventional phase shift TLs.

Graphical abstract: Dynamic phase control with printing and fluidic materials' interaction by inkjet printing an RF sensor directly on a stereolithographic 3D printed microfluidic structure

Article information

Article type
Paper
Submitted
12 May 2021
Accepted
19 Sep 2021
First published
20 Sep 2021

Lab Chip, 2021,21, 4364-4378

Dynamic phase control with printing and fluidic materials' interaction by inkjet printing an RF sensor directly on a stereolithographic 3D printed microfluidic structure

E. Park and S. Lim, Lab Chip, 2021, 21, 4364 DOI: 10.1039/D1LC00419K

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