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Issue 28, 2020
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Enhanced through-plane thermal conductivity in Polymer nanocomposites by constructing graphene-supported BN nanotubes

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Abstract

Although graphene-related nanocomposites have great potential for dissipating excess heat to ensure that electronic devices have high efficiencies and long service lives, their practical applications are restricted by the ultra-low through-plane thermal conductivity of these composites, which is due to interfacial thermal resistance between the graphene layers. Herein, exfoliated graphene (E-G)-boron nitride nanotube (E-G–BNNT) hierarchical structures are developed via the in situ growth of BNNTs on E-G. The BNNTs play an essential role in the construction of vertically aligned “bridges” for connecting E-G nanosheets during the hot-pressing process, while covalent C–N bonding at the E-G and BNNT interface creates a heat transfer pathway between graphene layers to reduce interfacial thermal resistance. The resultant E-G–BNNT composite has an architecture that is close to an ideal thermal conductive filler, and it is highly efficient at improving the through-plane thermal conductivity of PDVF-based nanocomposites, reaching 3.12 W m−1 K−1 at a loading of 15 wt%. Non-equilibrium molecular dynamics (NEMD) simulations further show that the development of covalent C–N bonding between E-G and BNNTs can effectively boost the interfacial thermal conductivity. Such excellent heat conduction performance allows the nanocomposite to show great potential for thermal management.

Graphical abstract: Enhanced through-plane thermal conductivity in Polymer nanocomposites by constructing graphene-supported BN nanotubes

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Supplementary files

Article information


Submitted
16 Apr 2020
Accepted
10 Jun 2020
First published
10 Jun 2020

J. Mater. Chem. C, 2020,8, 9569-9575
Article type
Paper

Enhanced through-plane thermal conductivity in Polymer nanocomposites by constructing graphene-supported BN nanotubes

X. Li, Y. Li, M. M. Alam, J. Miao, P. Chen, R. Xia, B. Wu and J. Qian, J. Mater. Chem. C, 2020, 8, 9569
DOI: 10.1039/D0TC01871F

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