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An Intrinsically Stretchable and Ultrasensitive Nanofiber-Based Resistive Pressure Sensor for Wearable Electronics

Abstract

To date, most skin-like pressure sensors largely depend on the conventional lithography technique for fabricating microstructures, limited by chemical-intensive with time-consuming manufacturing processes that have limited the implementation scalability. Herein, we present the nano-resistors alongside the fibrous interlocked microstructures (FIMs) concept integrated by a one-step electrospinning technique, which is a cost-effective, lithographic-free approach with large-area expandability to fabricate skin-inspired resistant-type pressure sensors with ultrahigh performance and lightweight characteristics. The unique elastic sandwich-structured conducting nanofiber (ESSCN) configuration comprises poly(styrene-block-ethylene-ran-butylene-block-styrene) (SEBS) natural rubber and silver nanoparticles (AgNPs), whereas the dielectric SEBS nanofiber is employed as the middle layer, sandwiched by two SEBS/AgNP electrodes at the top and bottom for packaging. The FIM endows the obtained pressure sensors with superior performance, including an ultrahigh sensitivity of 71.07 kPa-1 in a low-pressure area (<0.06 kPa), rapid response time (<2 ms), highly reproducible stability (>5000 cycles) with excellent off/on switching behaviors, and mechanical stimuli sensing (pressure, strain, and bending). As a proof-of-concept demonstration, the sensors can be carried out by integration with an RGB-LED wristband and garments, and for monitoring human physiological signals, thereby endowing our ESSCN with broader potential applications in versatile electronic skin and human–machine interfaces.

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Supplementary files

Article information


Submitted
04 Feb 2020
Accepted
24 Mar 2020
First published
26 Mar 2020

J. Mater. Chem. C, 2020, Accepted Manuscript
Article type
Communication

An Intrinsically Stretchable and Ultrasensitive Nanofiber-Based Resistive Pressure Sensor for Wearable Electronics

F. Liang, H. Ku , C. Cho , W. Cheng, W. Lee, W. Chen, S. Rwei, R. Borsali and C. Kuo, J. Mater. Chem. C, 2020, Accepted Manuscript , DOI: 10.1039/D0TC00593B

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