High thermal conductivity property of polyamide-imide/boron nitride composite films by doping boron nitride quantum dots†
In this study, we report a flexible polyamide-imide (PAI)/boron nitride nanosheet (BNNS) composite film with improved thermal conductivity by doping boron nitride quantum dots (BNQDs) using an evaporation-induced self-assembly method. Continuous thermal conductive paths are constructed using BNQDs and BNNS in a PAI matrix, and the heat flow is effectively transmitted along the paths to improve the in-plane thermal conductivity (TC) of the PAI composite film. The synergistic effect between the BNNS and BNQDs plays a pivotal role in the formation of a continuous thermal conductive path. The PAI/BNNS/BNQD composite film shows an in-plane thermal conductivity of 7.69 W m−1 K−1 at a BNNS loading of 9 wt% and a BNQD loading of 1 wt%. This work provides valuable guidance for the design of thermal management materials to meet the efficient heat dissipation requirements of electronic devices.