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Moisture resistance evaluation on single electronic package moulding compound

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Abstract

Non-destructive evaluation indices that correlate with the moisture resistance of integrated circuit packages are developed. These indices are developed from detailed studies on the functional groups in a moulding compound, and their effectiveness is verified experimentally. With these indices, one can ensure the moisture resistance of an individual package without the need of the standard humidity tests which require long test durations on limited number of samples where extrapolation with statistical uncertainty will be present.

Graphical abstract: Moisture resistance evaluation on single electronic package moulding compound

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Publication details

The article was received on 06 Aug 2019, accepted on 13 Nov 2019 and first published on 14 Nov 2019


Article type: Paper
DOI: 10.1039/C9TC04298A
J. Mater. Chem. C, 2020, Advance Article

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    Moisture resistance evaluation on single electronic package moulding compound

    C. M. Tan, U. Narula, G. L. Seow, V. Sangwan, C. H. Chen, S. P. Lin and J. Y. Chen, J. Mater. Chem. C, 2020, Advance Article , DOI: 10.1039/C9TC04298A

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