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Constructing fully carbon-based fillers with hierarchical structure to fabricate highly thermally conductive polyimide nanocomposites

Abstract

Thermal conductivity enhancement of polymer composites by adding single kind of carbon-based fillers is still at the price of reducing mechanical properties. In this study, a novel kind of fully carbon-based fillers (f-MWCNT-g-rGO) is constructed by a reaction between amino functionalized multi-walled carbon nanotubes (f-MWCNT) and graphene oxide (GO) followed by chemical reduction. The highly thermally conductive polyimide nanocomposites (f-MWCNT-g-rGO/PI) are fabricated through the combining method of in-situ polymerization, electrospinning and hot pressing. UV-vis spectrum, Raman, TGA, XPS, XRD, TEM and AFM characterizations all demonstrate the f-MWCNTs-g-rGO nanocomposites have completed hierarchical “line-plane” structure, and f-MWCNT contacts with rGO by chemical interaction. The fabricated f-MWCNT-g-rGO/PI nanocomposites possess outstanding thermal conductivity coefficient (λ), high glass transition temperature (Tg) & heat resistance index (THRI) and excellent mechanical properties. The f-MWCNT-g-rGO/PI nanocomposites reach the maximum λ of 1.60 W/mK and the λ enhancement is about 490% at a low f-MWCNT-g-rGO loading of 10 wt% while the mass ratio of rGO to f-MWCNT is 2:1. In addition, an improved thermal conduction model that more fits the experimental λ is established while comprehensively considering the interfaces, fillers alignment, etc. Owing to the highly thermal conductivities while preserving good mechanical properties and thermal stabilities at low fillers loading, the f-MWCNT-g-rGO/PI nanocomposites expected to be used as thermal pads in LED substrates and liquid crystal displays.

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Supplementary files

Publication details

The article was received on 03 Apr 2019, accepted on 17 Apr 2019 and first published on 17 Apr 2019


Article type: Paper
DOI: 10.1039/C9TC01804B
J. Mater. Chem. C, 2019, Accepted Manuscript

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    Constructing fully carbon-based fillers with hierarchical structure to fabricate highly thermally conductive polyimide nanocomposites

    Y. Guo, K. Ruan, X. Yang, T. Ma, J. Kong, N. Wu, J. Zhang, J. Gu and Z. Guo, J. Mater. Chem. C, 2019, Accepted Manuscript , DOI: 10.1039/C9TC01804B

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