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Issue 40, 2019
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Surface dual-oxidation induced metallic copper doping into NiFe electrodes for electrocatalytic water oxidation

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Abstract

Although NiFe-based (oxy)hydroxides species have been recognized as one of the most promising water oxidation catalysts, existing synthetic methods are difficult to fulfill the requirements of catalytic performance, lifetime and large-scale production. Here, we develop a scaled-up and simple dual-oxidative etching strategy for introducing metallic copper into a NiFe hydroxide nanosheet array on a Ni foam electrode (Cu–NiFe LDH/NF) for the oxygen evolution reaction. This dual-oxidation strategy is achieved via a galvanic–corrosion reaction between the metallic Ni template and ions with higher reduction potential (Fe3+ and Cu2+). The as-prepared electrode exhibits unparalleled activity toward water oxidation with an overpotential of 185 mV at a current density of 10 mA cm−2 and Tafel slope of merely 30 mV dec−1, respectively. More importantly, this inexpensive and simple manufacturing technique affords the Cu–NiFe LDH/NF electrode excellent activity retention for over 1200 hours.

Graphical abstract: Surface dual-oxidation induced metallic copper doping into NiFe electrodes for electrocatalytic water oxidation

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Publication details

The article was received on 12 Aug 2019, accepted on 20 Sep 2019 and first published on 21 Sep 2019


Article type: Communication
DOI: 10.1039/C9TA08797D
J. Mater. Chem. A, 2019,7, 22889-22897

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    Surface dual-oxidation induced metallic copper doping into NiFe electrodes for electrocatalytic water oxidation

    Y. Ma, K. Wang, D. Liu, X. Yang, H. Wu, C. Xiao and S. Ding, J. Mater. Chem. A, 2019, 7, 22889
    DOI: 10.1039/C9TA08797D

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