Facile fabrication of an F-POSS polymer based liquid-repellent Cu mesh with excellent durability and self-cleaning performance
A facile method that combines alkali-assisted oxidation and -SH chelation with click chemistry reaction is employed to create an F-POSS polymer surface (fluorinated Octavinyl Polyhedral Oligomeric Silsesquioxane polymer) based Cu mesh (F-POSS-OM). The prepared F-POSS-OM surface displays cohering hierarchical nano-F-POSS polymer granules/micro-Cu(OH)2 wires structure, which provides re-entrant geometry needed for liquid-repellency and low liquids sliding angles (<15°). Meanwhile, the easy-prepared structure endows the F-POSS-OM with remarkable durability to mechanical and chemical damages including wear abrasion, tape-peeling, 100 cm-height hammer impact, severe hand twisting, strong acid/ base/salt solution, and high temperature. Importantly, F-POSS-OM still retains excellent self-cleaning performance even after being subjected to these damages.