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Antimicrobial hexagonal boron nitride nanoplatelet composites for the thermal management of medical electronic devices

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Abstract

Hospitals need adequately clean environments to avoid the growth of bacteria; however, most thermally conductive materials used as a housing for medical electronic devices provide an ideal substrate for bacterial growth. Herein, we grafted quaternary ammonium compounds (QACs) on the surfaces of h-BN nanoplatelets via hydroxylation to form functional fillers for linear low-density polyethylene (LLDPE); as expected, the results of the antimicrobial testing of the 25 vol% QACs@h-BN/LLDPE nanoplatelet composites showed approximately 100% growth inhibition against both E. coli and S. aureus bacteria. Also, the zone-of-inhibition test confirms that the disinfection method of QACs@h-BN/LLDPE nanoplatelet composites is contact killing without the release of biocides, which cause environmental pollution. Notably, morphology analyses (SEM) revealed that the introduction of organic chains onto h-BN also significantly improved the degree of interface combination with LLDPE, which promoted more efficient heat transfer. The thermal conductivity of the 25 vol% QACs@h-BN/LLDPE nanoplatelet composites could reach 1.115 W m−1 K−1; this value distinctly exceeded that of the unmodified h-BN/LLDPE nanoplatelet composites (0.926 W m−1 K−1). Moreover, the preparation strategy of this research is substrate independent; therefore, the modified QACs@h-BN nanoplatelets can be applied to a broad range of materials to prepare different types of thermally conductive and antimicrobial composite materials.

Graphical abstract: Antimicrobial hexagonal boron nitride nanoplatelet composites for the thermal management of medical electronic devices

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Publication details

The article was received on 24 Jun 2019, accepted on 05 Sep 2019 and first published on 07 Sep 2019


Article type: Research Article
DOI: 10.1039/C9QM00411D
Mater. Chem. Front., 2019, Advance Article

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    Antimicrobial hexagonal boron nitride nanoplatelet composites for the thermal management of medical electronic devices

    S. Xiong, P. Zhang, Y. Xia, P. Fu and J. Gai, Mater. Chem. Front., 2019, Advance Article , DOI: 10.1039/C9QM00411D

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