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Laser writing of highly conductive and anti-oxidative copper structures in liquid

Abstract

Flexible conductive structures are essential to the fabrication of commercial integrated electronic devices. Developing efficient processes for manufacturing these structures with high conductivity and stability is significant. Based on a modifiable cost-effective Cu-based ionic liquid precursor, here we present an in-situ laser patterning technique to manufacture the flexible electrodes. The fabricated Cu structure owns an excellent conductivity approximately comparable to that of bulk Cu, while its oxidation resistance could be further enhanced by introducing an additional carbon source to form a Cu@C microstructure. Their chemical and electrical stability are evaluated. This method provides a possible bottom-up route for manufacturing of microelectronic devices in one-step, as the flexible heater we demonstrated.

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Publication details

The article was received on 22 Aug 2019, accepted on 03 Nov 2019 and first published on 04 Nov 2019


Article type: Paper
DOI: 10.1039/C9NR07248A
Nanoscale, 2019, Accepted Manuscript

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    Laser writing of highly conductive and anti-oxidative copper structures in liquid

    X. Zhou, W. Guo, Y. Zhu and P. Peng, Nanoscale, 2019, Accepted Manuscript , DOI: 10.1039/C9NR07248A

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