Laser writing of highly conductive and anti-oxidative copper structures in liquid
Flexible conductive structures are essential to the fabrication of commercial integrated electronic devices. Developing efficient processes for manufacturing these structures with high conductivity and stability is significant. Based on a modifiable cost-effective Cu-based ionic liquid precursor, here we present an in-situ laser patterning technique to manufacture the flexible electrodes. The fabricated Cu structure owns an excellent conductivity approximately comparable to that of bulk Cu, while its oxidation resistance could be further enhanced by introducing an additional carbon source to form a Cu@C microstructure. Their chemical and electrical stability are evaluated. This method provides a possible bottom-up route for manufacturing of microelectronic devices in one-step, as the flexible heater we demonstrated.