Effect of microcapsules partially filled with viscoelastic acrylate polymer on damping behaviours of epoxy resin
This paper presented the discussion of vibration damping enhancement offered by the composites made up of partially filled PU/PUA microcapsules and epoxy resin E51. Seven types of microcapsules (with a core mass fraction of about 60 wt.%) were prepared in which core materials were acrylate polymers with different Tg (-53.59 ℃-34.40 ℃), respectively. Dynamic mechanical analysis measurements were performed to investigate the dynamic mechanical properties of the composites, such as storage modulus E’ and damping factor tan δ. The correlations between the dynamic mechanical properties and the Tg of core material of the partially filled microcapsules were studied. The microcapsule concentration of 15.4 wt.% was found more efficient in adjusting the tan δ and the Tα of the epoxy E51. MP60-4/EP composite reached the highest tan δmax value 0.82. By controlling the Tg of core material, the tan δ of composites at low temperature region increased from 0.12 to 0.29 and the Tα could be ranged from 77.1 ℃ to 114.8 ℃.