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Fenton-based treatment of electroless copper plating waste for organics mineralization and CuO recovery

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Abstract

Fenton-based oxidation was used to treat an actual electroless copper plating waste solution containing a mixture of organic compounds including tartaric acid, formaldehyde and formic acid. As a novel advancement, the naturally present Cu(II) ions were directly used as a catalyst. An external metal ion, particularly Fe(II), was not required and only hydrogen peroxide was added to generate oxidizing hydroxyl radicals. During treatment, a substantial increase in solution temperature was observed as a result of tartaric acid degradation and the highly exothermic process enhanced the decomposition of formaldehyde and formic acid. The major organic components were completely mineralized, leaving only a small amount of oxalic acid. By the Cu-Fenton, close to 99% TOC and COD removal was achieved. The high temperature oxidation also led to the almost complete removal (<0.1 ppm residual) and recovery of Cu ions as a low volume CuO precipitate during alkalinization.

Graphical abstract: Fenton-based treatment of electroless copper plating waste for organics mineralization and CuO recovery

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Publication details

The article was received on 21 Feb 2019, accepted on 04 Apr 2019 and first published on 10 Apr 2019


Article type: Communication
DOI: 10.1039/C9GC00641A
Citation: Green Chem., 2019, Advance Article

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    Fenton-based treatment of electroless copper plating waste for organics mineralization and CuO recovery

    R. R. Navarro, H. Ichikawa and K. Tatsumi, Green Chem., 2019, Advance Article , DOI: 10.1039/C9GC00641A

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