Materials chemistry in flexible electronics
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- This article is part of the themed collection: Materials chemistry in flexible electronics
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a
Innovative Centre for Flexible Devices (iFLEX), School of Materials Science and Engineering, Nanyang Technological University, 50 Nanyang Avenue, Singapore
E-mail:
chenxd@ntu.edu.sg
b Department of Materials Science and Engineering, Northwestern University, Evanston, Illinois 60208, USA
c Center for Bio-Integrated Electronics, Northwestern University, Evanston, Illinois 60208, USA
d
Departments of Biomedical Engineering, Neurological Surgery, Chemistry, Mechanical Engineering, Electrical Engineering, and Computer Science, Simpson Querrey Institute for Nano/Biotechnology, Northwestern University, Evanston, Illinois 60208, USA
E-mail:
jrogers@northwestern.edu
e
Bertarelli Foundation Chair in Neuroprosthetic Technology, Laboratory for Soft Bioelectronic Interfaces, Institute of Microengineering, Institute of Bioengineering, Centre for Neuroprosthetics, École Polytechnique Fédérale de Lausanne (EPFL), 1202 Geneva, Switzerland
E-mail:
stephanie.lacour@epfl.ch
f
Tianjin Key Laboratory of Molecular Optoelectronic Science, Department of Chemistry, School of Science, Tianjin University & Collaborative Innovation Center of Chemical Science and Engineering (Tianjin), Tianjin 300072, China
E-mail:
huwp@tju.edu.cn
g Center for Nanoparticle Research, Institute for Basic Science (IBS), Seoul 08826, Republic of Korea
h
Institute of Chemical Processing (ICP), Seoul National University, Seoul 08826, Republic of Korea
E-mail:
dkim98@snu.ac.kr
A graphical abstract is available for this content
X. Chen, J. A. Rogers, S. P. Lacour, W. Hu and D. Kim, Chem. Soc. Rev., 2019, 48, 1431 DOI: 10.1039/C9CS90019E
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