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Issue 45, 2019
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A cross-interface model for thermal transport across the interface between overlapped nanoribbons

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Abstract

The application of low-dimensional materials for heat dissipation requires a comprehensive understanding of thermal transport at cross-interfaces, which widely exist in various composite materials and electronic devices. In this work, an analytical model is proposed, named as the cross-interface model (CIM), to accurately reveal the essential mechanism of the two-dimensional thermal transport at cross-interfaces. The applicability of CIM is validated through a comparison of the analytical results with molecular dynamics simulations for a typical cross-interface between two overlapped boron nitride nanoribbons. Besides, it is found that both the thermal resistances and the factor, η, has an important influence on the thermal transport. These investigations would deepen the understanding of the thermal transport at cross-interfaces and also facilitate the application of low-dimensional materials in thermal management.

Graphical abstract: A cross-interface model for thermal transport across the interface between overlapped nanoribbons

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Publication details

The article was received on 24 Aug 2019, accepted on 07 Oct 2019 and first published on 07 Oct 2019


Article type: Paper
DOI: 10.1039/C9CP04694A
Phys. Chem. Chem. Phys., 2019,21, 25072-25079

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    A cross-interface model for thermal transport across the interface between overlapped nanoribbons

    W. Feng, X. Yu, Y. Wang, D. Ma, Z. Sun, C. Deng and N. Yang, Phys. Chem. Chem. Phys., 2019, 21, 25072
    DOI: 10.1039/C9CP04694A

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