Jump to main content
Jump to site search


Lightweight, thermally insulating, and low dielectric microcellular high-impact polystyrene (HIPS) foams fabricated by high-pressure foam injection molding with mold opening

Author affiliations

Abstract

In this study, we used a high-pressure foam injection molding process to fabricate microcellular high-impact polystyrene (HIPS) foams with a tailored cellular structure. The process is cost-effective, highly efficient and flexible, and can be easily scaled up to complex components. The cellular structure of HIPS foam can be tuned over a wide range by manipulating packing time, cooling time, mold temperature, and mold-opening distance. Microcellular HIPS foam with a weight reduction of up to 60% was prepared, which possesses a low thermal conductivity of 60 mW m−1 K−1 and an ultra-low dielectric constant of 1.25. Both the thermal conductivity and the dielectric constant can be tailored by regulating the expansion ratio of HIPS foam. Mathematical models based on the mixing rule were developed to clarify the dependence of thermal conductivity and dielectric constant on the cellular structure of the foam. The outstanding thermally and electrically insulating properties of HIPS foams come from a large amount of air in the microcellular structure. These lightweight, thermally insulating, and ultralow dielectric microcellular HIPS foams hold great promise as an ultra-efficient insulating material for future use in many applications such as microelectronics and microelectromechanical systems (MEMSs).

Graphical abstract: Lightweight, thermally insulating, and low dielectric microcellular high-impact polystyrene (HIPS) foams fabricated by high-pressure foam injection molding with mold opening

Back to tab navigation

Supplementary files

Publication details

The article was received on 24 Aug 2018, accepted on 11 Oct 2018 and first published on 15 Oct 2018


Article type: Paper
DOI: 10.1039/C8TC04248A
Citation: J. Mater. Chem. C, 2018, Advance Article
  •   Request permissions

    Lightweight, thermally insulating, and low dielectric microcellular high-impact polystyrene (HIPS) foams fabricated by high-pressure foam injection molding with mold opening

    G. Wang, G. Zhao, G. Dong, L. Song and C. B. Park, J. Mater. Chem. C, 2018, Advance Article , DOI: 10.1039/C8TC04248A

Search articles by author

Spotlight

Advertisements