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Issue 12, 2018
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Targeted deposition of organic semiconductor stripes onto rigid, flexible, and three-dimensional substrates

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Abstract

Efficient solution-based growth of electronic materials is needed to enable low-cost wearable electronics, medical sensors, soft robotics, and energy harvesting technologies. In this study, a wetting-mediated two-phase dip coating method is developed to deposit high-performance organic semiconductor stripes at pre-specified locations on rigid, flexible, and three-dimensional substrates. This approach produces highly-oriented 6,13-bis(triisopropylsilylethynyl)pentacene (TIPS-pentacene) crystallites, leading to hole mobilities up to 0.83 cm2 V−1 s−1 along the crystallite axis. The deposition method requires minimal amounts of starting material (4 μL per centimeter of substrate length) and can easily be scaled for deposition onto large (meter-scale) substrates. Wetting-mediated two-phase dip coating also enables the targeted deposition of organic semiconductors onto folded and complex three-dimensional substrates creating new opportunities for unconventional electronic applications.

Graphical abstract: Targeted deposition of organic semiconductor stripes onto rigid, flexible, and three-dimensional substrates

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Supplementary files

Article information


Submitted
24 Jan 2018
Accepted
09 Feb 2018
First published
19 Feb 2018

J. Mater. Chem. C, 2018,6, 2970-2977
Article type
Paper

Targeted deposition of organic semiconductor stripes onto rigid, flexible, and three-dimensional substrates

T. Yang, J. S. Mehta, A. M. Haruk and J. M. Mativetsky, J. Mater. Chem. C, 2018, 6, 2970 DOI: 10.1039/C8TC00395E

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