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Issue 23, 2018
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Formation of tin-based crystals from a SnAgCu alloy under formic acid vapor

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Abstract

The use of formic acid vapor in soldering is growing. In the presence of SnAgCu powder, used as a bonding material to replace Pb-containing alloys, undesired deposits are observed. To understand this phenomenon, the mass change of a sample of alloys was investigated between 40 and 260 °C and the evolved gas was analyzed. In the quest to identify the unwanted deposits, a new strategy was researched and developed to increase the quantity of the produced deposit and to obtain it on a target surface for further studies. Unexpectedly, crystals were produced. The growth process of the crystals was optimized to reach crystal structures at nearly 1 mm in height. Unusual shapes were detected.

Graphical abstract: Formation of tin-based crystals from a SnAgCu alloy under formic acid vapor

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Publication details

The article was received on 15 Aug 2018, accepted on 18 Oct 2018 and first published on 24 Oct 2018


Article type: Paper
DOI: 10.1039/C8NJ04173C
Citation: New J. Chem., 2018,42, 19232-19236
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    Formation of tin-based crystals from a SnAgCu alloy under formic acid vapor

    F. Conti, A. Hanss, O. Mokhtari, S. K. Bhogaraju and G. Elger, New J. Chem., 2018, 42, 19232
    DOI: 10.1039/C8NJ04173C

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