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A new 3-D coordination polymer as precursor for CuI-based thermoelectric composite application

Abstract

Two complexes, [Cu6I6(L1)3]n (I) and [Cu4I4(L2)2]n (II) as precursors for thermoelectric composites were prepared from a literature procedure (L1 = 1,4-bis(phenylthio)but-2-yne; L2 = 1,4-bis(phenylthio)butane). During the preparation of I, an unexpected 3-D polymorph [Cu4I4(L1)2]n (1) with triclinic space group and infinite [CuI]n staircase structure was obtained. This new polymorph (1) exhibited the same structure at both room temperature and 173 K. Complexes 1 and II were therefore pyrolised to composites 2 and 3, respectively, at 400 ○C under nitrogen gas flow. Composite 3 was pale in color with a low carbon content (0.05 wt%) and easily disassembled during handling. By comparison, the high carbon containing (10.2 wt%) composite 2 can be compressed into a robust, light pellet (density 3.58 g/cm3), which showed a moderate to high Seebeck coefficient (543-1308 μV/K) over the tempearure range 70-240 ○C.

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Publication details

The article was received on 07 Aug 2018, accepted on 01 Oct 2018 and first published on 01 Oct 2018


Article type: Paper
DOI: 10.1039/C8DT03219J
Citation: Dalton Trans., 2018, Accepted Manuscript
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    A new 3-D coordination polymer as precursor for CuI-based thermoelectric composite application

    S. Bai, H. A. Nguyen, H. Wong, N. Zhang, L. Ke, M. Lin, D. J. Young and T. S. A. Hor, Dalton Trans., 2018, Accepted Manuscript , DOI: 10.1039/C8DT03219J

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