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Issue 46, 2017
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Cooperative supramolecular polymerization of a perylene diimide derivative and its impact on electron-transporting properties

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Abstract

H-bonding-promoted supramolecular polymerization of a perylene diimide (PDI) building block and its impact on charge carrier mobility were studied. PDI-1, containing a carboxylic acid group, exhibits H-aggregation in a non-polar solvent decalin while in THF or chloroform it remains in the monomeric form. In contrast, the control molecule PDI-2, containing an ester group does not show aggregation even in decalin, indicating that H-bonding among the carboxylic acid is primarily responsible for H-aggregation, which is further verified by the FT-IR study. A variable temperature UV/Vis study establishes a cooperative pathway for the supramolecular polymerization of PDI-1. Microscopy images show a short fibrillar morphology. Flash-photolysis time-resolved microwave conductivity (FP-TRMC) measurements reveal significantly higher electrical conductivity for the PDI-1 film prepared from decalin compared with that prepared from THF/MeOH or the film of non-aggregated PDI-2 prepared from decalin. By combining the transient absorption spectroscopy data (that estimate the charge carrier generation efficiency) and the TRMC evaluated conductivity, the 1D charge carrier mobility of PDI-1 (μe,1D) is estimated to be 0.24 cm2 V−1 s−1, which is among the top values reported for any PDI derivative measured using the same technique.

Graphical abstract: Cooperative supramolecular polymerization of a perylene diimide derivative and its impact on electron-transporting properties

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Supplementary files

Article information


Submitted
14 Sep 2017
Accepted
03 Nov 2017
First published
03 Nov 2017

Phys. Chem. Chem. Phys., 2017,19, 31024-31029
Article type
Paper

Cooperative supramolecular polymerization of a perylene diimide derivative and its impact on electron-transporting properties

D. Basak, D. S. Pal, T. Sakurai, S. Yoneda, S. Seki and S. Ghosh, Phys. Chem. Chem. Phys., 2017, 19, 31024
DOI: 10.1039/C7CP06298B

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