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Issue 45, 2016
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Self-reducible copper ion complex ink for air sinterable conductive electrodes

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Abstract

Copper (Cu) based conductive inks have been widely studied with the objective of achieving highly conductive and low-cost electrodes for various electrical devices. However, the unstable oxidation properties of Cu inks make them difficult to be applied for a wide range of practical applications. The oxidation properties induce high resistivity in the electrode fabrication, and storage problem of ink. Herein, we introduce a novel self-reducible Cu ion complex ink (Cu-ink), composed by formate, alkanolamine groups and poly alcohols, for the air sinterable, low-cost, environmentally friendly fabrication of Cu conductive electrodes. The air sinterable properties of this novel Cu-ink are induced by the self-reducing activity of the Cu-ink ligand decomposition and the reduction-assistance properties of the polyol solvents. In particular, among various polyol solvents, glycerol was found to be the most suitable reduction assistant-material because of its relatively abundant hydroxyl groups, good evaporation properties, and environmentally friendly solvents. Through investigation of the Cu-ink sintering temperature and glycerol contents, we obtained the Cu electrode films with a low resistivity of 17 μΩ cm at 350 °C under air sintering conditions. Furthermore, various practical characteristics such as excellent storage stability (of up to 4 weeks), enhanced adhesion properties, and flexible retention characteristics for up to 2000 bending times (R/R0 < 1.2, bending radius 20 mm) were also demonstrated for Cu electrode films.

Graphical abstract: Self-reducible copper ion complex ink for air sinterable conductive electrodes

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Supplementary files

Article information


Submitted
23 Sep 2016
Accepted
18 Oct 2016
First published
20 Oct 2016

J. Mater. Chem. C, 2016,4, 10740-10746
Article type
Paper

Self-reducible copper ion complex ink for air sinterable conductive electrodes

S. Cho, Z. Yin, Y. Ahn, Y. Piao, J. Yoo and Y. S. Kim, J. Mater. Chem. C, 2016, 4, 10740
DOI: 10.1039/C6TC04145K

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