Polyimide complexes with high dielectric performance: toward polymer film capacitor applications

Abstract

Novel polyimide–copper complexes (PICuCs) with a high dielectric constant of up to 133 were prepared by polymerization, complexation and imidization of a newly synthesized bipyridine-containing diamine monomer. The PICuCs showed high dielectric constant because of the enhanced electronic depolarization. Moreover, the PICuCs presented better mechanical and thermal properties than neat PI, which are promising materials for polymer film capacitors.