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Issue 44, 2015
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Incompletely condensed POSS-based spin-on-glass networks for impeccable ultra low-k integration

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Abstract

Poly(methyl)silsesquioxane-based spin-on-glass resins incorporating both a cyclic precursor, 1,3,5,7-tetramethyl 1,3,5,7-tetrahydroxyl cyclosiloxane, and incompletely condensed methyl-substituted POSS were synthesized and their thermal, mechanical, and electrical properties were investigated as a function of the POSS loading content. By introducing incompletely condensed methyl-substituted POSS compounds at the molecular level as sol–gel precursors, exceptional thermal stability (>700 °C), good mechanical properties (elastic modulus >4.0 GPa), and an ultra-low dielectric constant (k = 1.8) were obtained. In addition to providing a new route towards fully poly(methyl)silsesquioxane-based spin-on-glass resins with the above properties, the realization of the application of integration circuits was evaluated to show that the ultra low-k, mechanically robust spin-on-glass materials were able to withstand harsh wet chemical and dry etching, as well as chemical mechanical planarization (CMP) processing.

Graphical abstract: Incompletely condensed POSS-based spin-on-glass networks for impeccable ultra low-k integration

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Publication details

The article was received on 28 Aug 2015, accepted on 12 Oct 2015 and first published on 13 Oct 2015


Article type: Paper
DOI: 10.1039/C5TC02683K
J. Mater. Chem. C, 2015,3, 11605-11611

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    Incompletely condensed POSS-based spin-on-glass networks for impeccable ultra low-k integration

    A. S. Lee, S. Choi, S. Y. Oh, H. S. Lee, B. Kim, S. S. Hwang and K. Baek, J. Mater. Chem. C, 2015, 3, 11605
    DOI: 10.1039/C5TC02683K

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