High depth-resolution laser ablation chemical analysis of additive-assisted Cu electroplating for microchip architectures

A. Riedo; V. Grimaudo; P. Moreno-García; M. B. Neuland; M. Tulej; P. Wurz; P. Broekmann

doi:10.1039/C5JA00295H

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High depth-resolution laser ablation chemical analysis of additive-assisted Cu electroplating for microchip architectures

A. Riedo, V. Grimaudo, P. Moreno-García, M. B. Neuland, M. Tulej, P. Wurz and P. Broekmann
J. Anal. At. Spectrom., 2015,30, 2371-2374
DOI: 10.1039/C5JA00295H, Communication

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Abstract | Cited by

Laser ablation/ionisation mass spectrometry with a vertical resolution at a nanometre scale was applied for the quantitative characterisation of the chemical composition of additive-assisted Cu electroplated deposits used in the microchip industry. The detailed chemical analysis complements information gathered by optical techniques and allows new insights into the metal deposition process.

Graphical abstract: High depth-resolution laser ablation chemical analysis of additive-assisted Cu electroplating for microchip architectures

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