Superhydrophobic CuO nanoneedle-covered copper surfaces for anticorrosion†
With unique water-repellency and self-cleaning properties, superhydrophobic surfaces promise a great potential of anticorrosion for engineered metals. The current study reports a facile and controllable anodization approach to fabricate superhydrophobic CuO nanoneedle array (NNA) films for the enhancement of corrosion resistance of copper substrates. The anodic CuO NNA films were grown on copper foils by electrochemical anodization in an aqueous KOH solution for different anodization times. The morphological features and crystalline structures of the anodic CuO NNA were characterized by SEM-EDS and XRD. The superhydrophobicity on the hierarchical CuO NNA films was achieved by chemical modification with fluoroalkyl-silane (FAS-17). The presence of low surface energy fluorosilanized carbon (–CFx) groups on the FAS-modified surfaces was ascertained by EDS, XPS and water contact angle analyses. The wetting behaviour of the FAS-modified surfaces was investigated to elucidate the correlation between the static water contact angles, surface roughness, dynamic water contact angle hysteresis, and anodization time. The FAS-modified copper surfaces demonstrated not only the desirable superhydrophobicity with a water contact angle as high as approximately 169° and contact angle hysteresis as low as about 5°, but also substantially improved corrosion resistance in an aqueous NaCl solution (3.5%) with an inhibition efficiency higher than 90%, as revealed by means of Tafel plots and EIS measurements. The stability and durability of the superhydrophobic FAS-modified surfaces were evaluated by observing the change in surface wettability and geometric microstructures as a function of exposure time in an aqueous NaCl solution.