Jump to main content
Jump to site search

Issue 43, 2014
Previous Article Next Article

Atomic layer deposition of Cu with a carbene-stabilized Cu(I) silylamide

Author affiliations

Abstract

The metal–organic Cu(I) complex 1,3-diisopropyl-imidazolin-2-ylidene copper hexamethyl disilazide has been tested as a novel oxygen-free precursor for atomic layer deposition of Cu with molecular hydrogen. Being a strong Lewis base, the carbene stabilizes the metal centre to form a monomeric compound that can be vaporised and transported without visible degradation. A significant substrate dependence of the growth process not only with respect to the film material but also to the structure of the films was observed. On Pd surfaces continuous films are grown and no phase boundary can be observed between the Cu film and the Pd, while island growth is observed on Ru substrates, which as a consequence requires thicker films in order to achieve a fully coalesced layer. Island growth is also observed for ultra-thin (<10 nm) Pd layers on Si substrates. Possible explanations for the different growth modes observed are discussed.

Graphical abstract: Atomic layer deposition of Cu with a carbene-stabilized Cu(i) silylamide

Back to tab navigation

Publication details

The article was received on 02 Jul 2014, accepted on 23 Sep 2014 and first published on 23 Sep 2014


Article type: Paper
DOI: 10.1039/C4TC01418A
Author version
available:
Download author version (PDF)
J. Mater. Chem. C, 2014,2, 9205-9214

  •   Request permissions

    Atomic layer deposition of Cu with a carbene-stabilized Cu(I) silylamide

    D. J. Hagen, I. M. Povey, S. Rushworth, J. S. Wrench, L. Keeney, M. Schmidt, N. Petkov, S. T. Barry, J. P. Coyle and M. E. Pemble, J. Mater. Chem. C, 2014, 2, 9205
    DOI: 10.1039/C4TC01418A

Search articles by author

Spotlight

Advertisements