Jump to main content
Jump to site search
Access to RSC content Close the message box

Continue to access RSC content when you are not at your institution. Follow our step-by-step guide.


Issue 19, 2013
Previous Article Next Article

Lab-on-CMOS integration of microfluidics and electrochemical sensors

Author affiliations

Abstract

This paper introduces a CMOS–microfluidics integration scheme for electrochemical microsystems. A CMOS chip was embedded into a micro-machined silicon carrier. By leveling the CMOS chip and carrier surface to within 100 nm, an expanded obstacle-free surface suitable for photolithography was achieved. Thin film metal planar interconnects were microfabricated to bridge CMOS pads to the perimeter of the carrier, leaving a flat and smooth surface for integrating microfluidic structures. A model device containing SU-8 microfluidic mixers and detection channels crossing over microelectrodes on a CMOS integrated circuit was constructed using the chip-carrier assembly scheme. Functional integrity of microfluidic structures and on-CMOS electrodes was verified by a simultaneous sample dilution and electrochemical detection experiment within multi-channel microfluidics. This lab-on-CMOS integration process is capable of high packing density, is suitable for wafer-level batch production, and opens new opportunities to combine the performance benefits of on-CMOS sensors with lab-on-chip platforms.

Graphical abstract: Lab-on-CMOS integration of microfluidics and electrochemical sensors

Back to tab navigation

Article information


Submitted
08 Apr 2013
Accepted
12 Jul 2013
First published
15 Jul 2013

Lab Chip, 2013,13, 3929-3934
Article type
Paper

Lab-on-CMOS integration of microfluidics and electrochemical sensors

Y. Huang and A. J. Mason, Lab Chip, 2013, 13, 3929
DOI: 10.1039/C3LC50437A

Social activity

Search articles by author

Spotlight

Advertisements