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Issue 6, 2013
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Natural resin shellac as a substrate and a dielectric layer for organic field-effect transistors

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Abstract

Biocompatible and sustainable electronic-grade materials are integral for the development of electronics for biointegration and ‘use-and-throw’ applications. Herein we report the use of the natural resin shellac in organic field-effect transistors. Shellac was employed to cast robust and smooth substrates suitable for durable transistor devices. In addition shellac displays excellent insulating properties enabling its use as a high-quality dielectric layer for organic field-effect transistor (OFET) devices. We demonstrate that two common organic semiconductors, pentacene and C60, show hysteresis-free operation in OFETs that employ shellac both as the substrate and as dielectric material. Shellac is a fully biocompatible (even edible) material that offers many advantages for OFET fabrication, including high dielectric breakdown fields, simple solution processing from ethanol solutions, and low temperature crosslinking at 50–70 °C. This work shows that shellac as a biomaterial can enable OFET applications where biocompatibility is necessary.

Graphical abstract: Natural resin shellac as a substrate and a dielectric layer for organic field-effect transistors

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Article information


Submitted
22 Feb 2013
Accepted
20 Mar 2013
First published
21 Mar 2013

Green Chem., 2013,15, 1473-1476
Article type
Communication

Natural resin shellac as a substrate and a dielectric layer for organic field-effect transistors

M. Irimia-Vladu, E. D. Głowacki, G. Schwabegger, L. Leonat, H. Z. Akpinar, H. Sitter, S. Bauer and N. S. Sariciftci, Green Chem., 2013, 15, 1473
DOI: 10.1039/C3GC40388B

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