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Issue 11, 2012
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Fabrication and investigation of a new copper-doped screen-printable carbon paste's conductive mechanism by AFM

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Abstract

This paper presents a new low-cost water-based carbon/copper screen printing conductive paste, with commercial micron-grade graphite, nanometer acetylene black and synthesized copper submicron particles of about 226 nm in diameter as the mixed conducting fillers. The relationship between micromorphology and conductivity of the screen-printed line patterns made by the paste was monitored by atomic force microscopy. There are several different packing modes of conducting fillers relating the conductivity of screen-printed line patterns. Variations in the copper content, sintering temperature and time can remarkably affect the packing density and conductivity. The addition of copper submicron particles to the paste further improved the particle osculation by filling the interstices among the micron-grade graphite layers and arranging themselves densely with the smaller acetylene black particles. The optimized paste reached a film resistivity of 33.3 mΩ cm using screen printing and annealing at 260 °C.

Graphical abstract: Fabrication and investigation of a new copper-doped screen-printable carbon paste's conductive mechanism by AFM

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Publication details

The article was received on 18 Jan 2012, accepted on 14 Mar 2012 and first published on 15 Mar 2012


Article type: Paper
DOI: 10.1039/C2RA20102J
RSC Adv., 2012,2, 4787-4791

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    Fabrication and investigation of a new copper-doped screen-printable carbon paste's conductive mechanism by AFM

    J. Zhang, Z. Liang, T. Hreid, W. Guo and Z. Yuan, RSC Adv., 2012, 2, 4787
    DOI: 10.1039/C2RA20102J

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