Issue 39, 2012

Direct electroplating of copper on tantalum from ionic liquids in high vacuum: origin of the tantalum oxide layer

Abstract

In this paper, it is shown that high vacuum conditions are not sufficient to completely remove water and oxygen from the ionic liquid 1-ethyl-3-methylimidazolium chloride. Complete removal of water demands heating above 150 °C under reduced pressure, as proven by Nuclear Reaction Analysis (NRA). Dissolved oxygen gas can only be removed by the use of an oxygen scavenger such as hydroquinone, despite the fact that calculations show that oxygen should be removed completely by the applied vacuum conditions. After applying a strict drying procedure and scavenging of molecular oxygen, it was possible to deposit copper directly on tantalum without the presence of an intervening oxide layer.

Graphical abstract: Direct electroplating of copper on tantalum from ionic liquids in high vacuum: origin of the tantalum oxide layer

Article information

Article type
Paper
Submitted
30 May 2012
Accepted
23 Jul 2012
First published
23 Jul 2012

Phys. Chem. Chem. Phys., 2012,14, 13624-13629

Direct electroplating of copper on tantalum from ionic liquids in high vacuum: origin of the tantalum oxide layer

S. Schaltin, L. D'Urzo, Q. Zhao, A. Vantomme, H. Plank, G. Kothleitner, C. Gspan, K. Binnemans and J. Fransaer, Phys. Chem. Chem. Phys., 2012, 14, 13624 DOI: 10.1039/C2CP41786C

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